ReWork

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

Features:

Easy-To-Use Auto Profiling Software User-friendly, simple thermal profile development Default reflow profiles for standard rework processes Advanced profile analysis software confirms successful profile development Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment Two-color LED optical alignment system allows for easy-to-see component to site alignment Motorized and programmable Z and Theta axis minimizes operator intervention Motorized and programmable X-Y table (option) for simplified component alignment Repeatable Thermal Performance Efficient Convection Heaters provide high thermal uniformity Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements Automatic Non-Contact Site Scavenging Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder Programmable X,Y, and Z axis eliminates operator intervention Nitrogen capability for consistent results without post scavenge cleaning MES Interface Track all operations performed on rework system from automatic event log Reflow processes easily transferred between systems Available Tooling for Any Surface Mount Component Standard nozzles for conventional components Special nozzles for unique components

Specifications:

Technical Parameters Placement Capability: 0.0020” (50u) mean + 3σ Maximum Board Size: 455 x 560mm (18 x 22”) Minimum Component Size: 0201 Maximum Field of View: 50mm (2.0”) Square Thermocouple Jacks: 6 (16 optional) Theta Motion: 360° Top Heater: 1600W Area Heater: 4000W Site Heater (option): 1000W

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

Features:

Easy-To-Use Auto Profiling Software User-friendly, simple thermal profile development Default reflow profiles for standard rework processes Advanced profile analysis software confirms successful profile development Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment Two-color LED optical alignment system allows for easy-to-see component to site alignment Motorized and programmable Theta axis minimizes operator intervention Motorized and programmable X-Y table (option) for fully automated rework Repeatable Thermal Performance Efficient Convection Heaters provide high thermal uniformity Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements Automatic Non-Contact Site Scavenging Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder Programmable X,Y, and Z axis eliminates operator intervention Nitrogen capability for consistent results without post scavenge cleaning MES Interface Track all operations performed on rework system from automatic event log Reflow processes easily transferred between systems Available Tooling for Any Surface Mount Component Standard nozzles for conventional components Special nozzles for unique components

Specifications:

Technical Parameters Placement Capability: 0.0005” (12u) mean + 3σ Maximum Board Size: 455 x 560mm (560 x 760mm optional) Minimum Component Size: 01005 Maximum Field of View: 65mm Square (80mm square optional) Thermocouple Jacks: 6 (14 optional) Theta Motion: 360° Top Heater: 2.2kW Area Heater: 4000W (7800W optional) Site Heater (optional): 1000W

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and repeatable rework processes. Motorized X, Y, Z, and theta axis and Component Auto Align software allow for fully automated rework, including components greater than 100mm. Independent non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

Technical Highlights:

Easy-To-Use Auto Profiling Software 4.0kW/7.8kW Convection Bottom Heater 2.2kW Focused Convection Top Heater 01005 -120mm Component Range 0.0005" Placement Accuracy 65mm/80mm Square FOV Multi-lens Optics & Digital Split Imaging Motorized & Programmable X,Y & Θ Automatic Non-Contact Site Scavenging Automatic Component Alignment (Including components >100mm) Automatic One-run Profiling

Special Features:

Fully Programmable Rework Operator Friendly Software & Interface Automatic Component Alignment Third Stage Heating Independent Site Scavenging One-run Auto Profiling Advanced Data Collection & MES Integration

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

Features:

Easy-To-Use Auto Profiling Software User-friendly, simple thermal profile development Default reflow profiles for standard rework processes Advanced profile analysis software confirms successful profile development Automatic reflow, remove, and replace profile created after development of Auto Profile Simple Component-to-Site Alignment Two-color LED optical alignment system allows for easy-to-see component to site alignment Motorized and programmable Z and Theta axis minimizes operator intervention Motorized and programmable X-Y table (option) for simplified component alignment Repeatable Thermal Performance Efficient Convection Heaters provide high thermal uniformity Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements Automatic Non-Contact Site Scavenging Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder Programmable X,Y, and Z axis eliminates operator intervention Nitrogen capability for consistent results without post scavenge cleaning MES Interface Track all operations performed on rework system from automatic event log Reflow processes easily transferred between systems Available Tooling for Any Surface Mount Component Standard nozzles for conventional components Special nozzles for unique components

Special Features:

Placement Capability: 0.0010” (25u) mean + 3σ Maximum Board Size: 600 x 900mm (650 x 1200mm optional) Minimum Component Size: 01005 80mm (3.2”) Square (90mm optional) Thermocouple Jacks: 6 (14 optional) Theta Motion: 360° Top Heater: 2200W Area Heater: 10,000W Site Heater: 1000W

Built with easy-to-use 1-2-3-GO Software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a replaceable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE Systems.

Features:

Easy-To-Use Auto Profiling Software User-friendly, simple thermal profile development Default reflow profiles for standard rework processes Advanced profile analysis software confirms successful profile development Automatic reflow, remove, and replace scavenging sequences Simple Component-to-Site Alignment Two-color LED optical alignment with automatic fiducial based component alignment Motorized and programmable Z and Theta axis minimizes operator intervention Motorized and programmable X-Y table (option) for simplified component alignment Repeatable Thermal Performance Efficient Convection Heaters provide high thermal uniformity Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements Automatic Non-Contact Site Scavenging Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder Programmable X,Y, and Z axis eliminates operator intervention Nitrogen capability for consistent results without post scavenge cleaning MES Interface Track all operations performed on rework system from automatic event log Reflow processes easily transferred between systems Available Tooling for Any Surface Mount Component Standard nozzles for conventional components Special nozzles for unique components

Special Features:

Automatic, fiducial based alignment 0.0024" (60u) mean + 3σ Manual Placement Capability: 0.0010" (25u) mean + 3σ Maximum Board Size: 600 x 900mm Minimum Component Size: 0201 (manual alignment) 80mm (3.2") Square Thermocouple Jacks: 6 (14 optional) Theta Motion: 360° Top Heater: 2200W Area Heater: 10,000W Site Heater: 1000W

Built with easy-to-use 1-2-3-GO Software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE Systems.

Features:

Easy-To-Use Auto Profiling Software User-friendly, simple thermal profile development Default reflow profiles for standard rework processes Advanced profile analysis software confirms successful profile development Automatic reflow, remove, and replace scavenging sequences Simple Component-to-Site Alignment Two-color LED optical alignment Motorized and programmable Z and Theta axis minimizes operator intervention Repeatable Thermal Performance Efficient Convection Heaters provide high thermal uniformity Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements Automatic Non-Contact Site Scavenging Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder Nitrogen capability for consistent results without post scavenge cleaning MES Interface Track all operations performed on rework system from automatic event log Reflow processes easily transferred between systems Available Tooling for Any Surface Mount Component Standard nozzles for conventional components Special nozzles for unique components

Special Features:

Maximum Board Size: 600 x 900mm (650 x 1200mm optional) Minimum Component Size: 0201 Field of View: 120mm (4.7") Square Thermocouple Jacks: 6 (14 optional) Theta Motion: 360° Top Heater: 2200W Area Heater: 10,000W Site Heater: 1000W